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HD74ALVC2G245
Dual Bus Transceivers with 3-state Output
REJ03D0176-0400Z (Previous ADE-205-641C (Z)) Rev.4.00 Dec.18.2003
Description
The HD74ALVC2G245 has two buffers with three state output in an 8 pin package. When DIR is high, data is transferred from the A inputs to the B outputs, and when DIR is low, data is transferred from the B inputs to the A outputs. The A and B buses are separated by making the enable input (OE) high level. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life.
Features
* The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Supply voltage range : 1.2 to 3.6 V Operating temperature range: -40 to +85C * All inputs VIH (Max.) = 3.6 V (@VCC = 0 V to 3.6 V) All outputs VO (Max.) = 3.6 V (@VCC = 0 V) * Output current 2 mA (@VCC = 1.2 V) 4 mA (@VCC = 1.4 V to 1.6 V) 6 mA (@VCC = 1.65 V to 1.95 V) 18 mA (@VCC = 2.3 V to 2.7 V) 24 mA (@VCC = 3.0 V to 3.6 V) * Ordering Information
Part Name HD74ALVC2G245USE Package Type SSOP-8 pin Package Code TTP-8DBV Package Abbreviation US Taping Abbreviation (Quantity) E (3,000 pcs/reel)
Rev.4.00, Dec.18.2003, page 1 of 10
HD74ALVC2G245
Outline and Article Indication
* HD74ALVC2G245
Index band Lot No.
YMW A45
SSOP-8 Marking
Y : Year code (the last digit of year) M : Month code W : Week code
Function Table
Inputs OE L L H H: L: X: High level Low level Immaterial DIR L H X Operation B data to A bus A data to B bus Isolation
Rev.4.00, Dec.18.2003, page 2 of 10
HD74ALVC2G245
Pin Arrangement
DIR
1
8
VCC
A1
2
7
OE
A2
3
6
B1
GND
4
5
B2
(Top view)
Absolute Maximum Ratings
Item Supply voltage range Input voltage range *1 Output voltage range
*1, 2
Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg
Ratings -0.5 to 4.6 -0.5 to 4.6 -0.5 to VCC+0.5 -0.5 to 4.6 -50 50 50 100 200 -65 to 150
Unit V V V
Conditions
Output : H or L or Z VCC : OFF
Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation *3 at Ta = 25C (in still air) Storage temperature Notes:
mA mA mA mA mW C
VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Rev.4.00, Dec.18.2003, page 3 of 10
HD74ALVC2G245
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC VI VO IOH Min 1.2 0 0 IOL Input transition rise or fall rate t / v Ta 0 0 Operating free-air temperature -40 Note: Unused or floating inputs must be held high or low. Max 3.6 3.6 VCC -2 -4 -6 -18 -24 2 4 6 18 24 20 10 85 C ns / V Unit V V V mA VCC = 1.2 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VCC = 1.2 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VCC = 1.2 to 2.7 V VCC = 3.30.3 V Conditions
Rev.4.00, Dec.18.2003, page 4 of 10
HD74ALVC2G245
Electrical Characteristics
(Ta = -40 to 85C)
Item Input voltage Symbol VIH VCC (V) * 1.2 1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 VIL 1.2 1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 Output voltage VOH Min to Max 1.2 1.4 1.65 2.3 3.0 VOL Min to Max 1.2 1.4 1.65 2.3 3.0 Input current Off state output current Quiescent supply current Output leakage current Input capacitance Output capacitance IIN IOZ ICC IOFF CIN CO 3.6 3.6 3.6 0 3.3 3.3 Min VCCx0.7 VCCx0.7 1.7 2.0 VCC-0.2 0.9 1.1 1.2 1.7 2.2 Typ 4.5 6.5 Max VCCx0.25 VCCx0.3 VCCx0.3 0.7 0.8 0.2 0.3 0.3 0.3 0.55 0.55 5 5 10 5 A A A A pF pF V IOH = -100 A IOH = -2 mA IOH = -4 mA IOH = -6 mA IOH = -18 mA IOH = -24 mA IOL = 100 A IOL = 2 mA IOL = 4 mA IOL = 6 mA IOL = 18 mA IOL = 24 mA VIN = 3.6 V or GND VO = VCC or GND VIN = VCC or GND, IO = 0 VIN or VO = 0 to 3.6 V VIN = VCC or GND VO = VCC or GND Unit V Test conditions
VCCx0.75
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Rev.4.00, Dec.18.2003, page 5 of 10
HD74ALVC2G245
Switching Characteristics
(Ta = -40 to 85C) VCC = 1.2 V
Item Propagation delay time Enable time Disable time Symbol tPLH tPHL tZH tZL tHZ tLZ Min Typ 7.0 8.5 7.0 Max Unit ns ns ns Test conditions CL = 15 pF CL = 15 pF CL = 15 pF FROM (Input) A or B OE OE TO (Output) B or A A or B A or B
VCC = 1.50.1 V
Item Propagation delay time Enable time Disable time Symbol tPLH tPHL tZH tZL tHZ tLZ Min 2.0 2.0 2.0 Typ Max 8.0 11.0 10.0 Unit ns ns ns Test conditions CL = 15 pF CL = 15 pF CL = 15 pF FROM (Input) A or B OE OE TO (Output) B or A A or B A or B
VCC = 1.80.15 V
Item Propagation delay time Enable time Disable time Symbol tPLH tPHL tZH tZL tHZ tLZ Min 1.5 1.5 1.5 Typ Max 6.0 8.0 7.5 Unit ns ns ns Test conditions CL = 30 pF CL = 30 pF CL = 30 pF FROM (Input) A or B OE OE TO (Output) B or A A or B A or B
Rev.4.00, Dec.18.2003, page 6 of 10
HD74ALVC2G245
Switching Characteristics (cont)
VCC = 2.50.2 V
Item Propagation delay time Enable time Disable time Symbol tPLH tPHL tZH tZL tHZ tLZ Min 1.0 1.0 1.0 Typ Max 4.0 5.0 4.5 Unit ns ns ns Test conditions CL = 30 pF CL = 30 pF CL = 30 pF FROM (Input) A or B OE OE TO (Output) B or A A or B A or B
VCC = 3.30.3 V
Item Propagation delay time Enable time Disable time Symbol tPLH tPHL tZH tZL tHZ tLZ Min 1.0 1.0 1.0 Typ Max 3.0 4.0 4.0 Unit ns ns ns Test conditions CL = 30 pF CL = 30 pF CL = 30 pF FROM (Input) A or B OE OE TO (Output) B or A A or B A or B
Operating Characteristics
(Ta = 25C)
Item Power dissipation capacitance Symbol CPD VCC (V) 1.5 1.8 2.5 3.3 Min Typ 13.0 13.0 14.0 17.0 Max Unit pF Test conditions f = 10 MHz
Rev.4.00, Dec.18.2003, page 7 of 10
HD74ALVC2G245
Test Circuit
VCC VCC
See Function Table
Input
OE Output A1 B1 CL DIR RL S1 RL S2
*1
Pulse Generator Z OUT = 50
OPEN See under table GND
Symbol
S2 V CC = 1.2 V, 1.50.1 V, V = 3.30.3 V CC 1.80.15 V, 2.50.2 V OPEN GND VCCx2 OPEN GND 6.0
t PLH / t PHL t HZ / t ZH t LZ / t ZL
Symbol RL CL
V CC = 1.2 V, V = 2.50.2 V, V = 1.80.15 V CC 1.50.1 V CC 3.30.3 V 2.0 k 15 pF 1.0 k 30 pF 500 30 pF
Notes: 1. C L includes probe and jig capacitance. 2. A2-B2 are idential to above load circuit. 3. S1 : Input-Output change switch.
Rev.4.00, Dec.18.2003, page 8 of 10
HD74ALVC2G245
* Waveforms - 1
tr 90 % 90 % Vref
tf VIH 10 % t PLH t PHL VOH Vref Vref VOL GND
Input
Vref 10 %
In phase output
* Waveforms - 2
90 % Vref
tf
tr 90 % Vref 10 % t ZL 10 % t LZ Vref t ZH t HZ Vref VH GND VOH VIH
Input OE
Waveform - A
VL
VOL VOH VOL
Waveform - B
Symbol tr / t f V IH V ref VH / V L
V CC = 1.2 V, 1.50.1 V 2.0 ns VCC 50% VH = VOH-0.1 V VL = VOL+0.1 V
V CC = 1.80.15 V V CC = 2.50.2 V 2.0 ns VCC 50% 2.5 ns VCC 50%
V CC = 3.30.3 V 2.5 ns 2.7 V 1.5 V
VH = VOH-0.15 V VH = VOH-0.15 V VH = VOH-0.3 V VL = VOL+0.15 V VL = VOL+0.15 V VL = VOL+0.3 V
Notes: 1. Input waveform : PRR 10 MHz, Zo = 50 , duty cycle 50%. 2. Waveform - A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform - B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement.
Rev.4.00, Dec.18.2003, page 9 of 10
HD74ALVC2G245
Package Dimensions
2.0 0.2 1.5 0.2 (0.5) (0.5) (0.5)
Unit: mm
(0.4) 2.3 0.1 3.1 0.3
0 - 0.1
8 - 0.2 - 0.05
+ 0.1
(0.17)
0.7 0.1 (0.4)
Package Code JEDEC JEITA Mass (reference value)
TTP-8DBV 0.010 g
Rev.4.00, Dec.18.2003, page 10 of 10
0.13 - 0.05
+ 0.1
Sales Strategic Planning Div.
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1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
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